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High thermal conductivity, good electrical properties, thermal expansion coefficient close to that of Si sheet, non-toxic, it is an ideal material to replace BeO ceramics.
Main Features
High thermal conductivity, good electrical properties, thermal expansion coefficient close to that of Si sheet, non-toxic, it is an ideal material to replace BeO ceramics.
Typical application
High-performance substrate materials and packaging materials for high-density hybrid circuits, microwave power devices, power electronic devices, optoelectronic components, semiconductor refrigeration and other products.
Material properties
| model | density | Thermal conductivity | coefficient of thermal expansion | Dielectric strength | Dielectriccoefficient | tgδ | Volume resistivity | Flexural strength |
| SD5111 | >3.20 | 80~100 | <4.5 | >15 | 9.0 | 3~10 | >10 13 | >20 |
| SD5113 | >3.25 | 100~130 | <4.3 | >15 | 8.7 | 3~7 | >10 14 | >25 |
| SD5115 | >3.25 | 140~170 | <4.3 | >15 | 8.7 | 3~7 | >10 14 | >28 |
| SD5116 | >3.26 | >170 | <4.2 | >15 | 8.7 | 3~7 | >10 14 | >30 |
